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3northway lane north latham,new york 12110. tollfree:1.800.984.5337 phone:1.518.956.2980 fax:1.518.785.4725 http://www.marktechopto.com specification part no. : MT6203-HRG-A 3.0mm round bi- polar lamp (3leads) observe precaution for handling electro static sensitive devices attention
MT6203-HRG-A 3.0mm round bi- polar lamp (3leads) ver.: 01 date: 2007/11/06 page: 1 /5 description this green and orange bi-color lamp is made with gap/gap green chip, gaasp/gap orange chip and wh ite diffused epoxy resin. common cathode orange anode green anode notes: 1. all dimensions are in mm. 2. tolerance is 0.25mm unless otherwise noted. description led chip part no. material emitting color lens color gap/gap green MT6203-HRG-A gaasp/gap orange white diffused
MT6203-HRG-A 3.0mm round bi- polar lamp (3leads) ver.: 01 date: 2007/11/06 page: 2 /5 absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation p d 78 mw reverse voltage v r 5 v d.c. forward current if 30 ma reverse (leakage) current ir 100 ? a peak current(1/10duty cycle,0.1ms pulse width.) if(peak) 100 ma operating temperature range topr -40 to +95
storage temperature range tstg -40 to +100
soldering temperature(1.6mm from body) tsol dip soldering : 260 for
5 sec. hand soldering : 350 for 3 sec.
electrical and optical characteristics: green parameter symbol condition min. typ. max. unit luminous intensity i v if=20ma 9.0 20.0 mcd forward voltage vf if=20ma 2.1 2.6 v peak wavelength p if=20ma 567 nm dominant wavelength d if=20ma 572 nm reverse (leakage) current ir vr=5v 100 a viewing angle 2 1/2 if=20ma 70 deg spectrum line halfwidth ? if=20ma 30 nm notes:1. the datas tested by is tester. 2. customer?s special requirements are also welcome.
MT6203-HRG-A 3.0mm round bi- polar lamp (3leads) ver.: 01 date: 2007/11/06 page: 3 /5 absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation p d 78 mw reverse voltage v r 5 v d.c. forward current if 30 ma reverse (leakage) current ir 100 ? a peak current(1/10duty cycle,0.1ms pulse width.) if(peak) 100 ma operating temperature range topr -40 to +95
storage temperature range tstg -40 to +100
soldering temperature(1.6mm from body) tsol dip soldering : 260 for
5 sec. hand soldering : 350 for 3 sec.
electrical and optical characteristics: orange parameter symbol condition min. typ. max. unit luminous intensity i v if=20ma 9.0 20.0 mcd forward voltage vf if=20ma 2.1 2.6 v peak wavelength p if=20ma 642 nm dominant wavelength d if=20ma 629 nm reverse (leakage) current ir vr=5v 100 a viewing angle 2 1/2 if=20ma 70 deg spectrum line halfwidth ? if=20ma 35 nm notes:1. the datas tested by is tester. 2. customer?s special requirements are also welcome.
MT6203-HRG-A 3.0mm round bi- polar lamp (3leads) ver.: 01 date: 2007/11/06 page: 4 /5 typical electrical / optica l characteristics curves : applied voltage (v) forward current vs.applied voltage forward current if(ma) 10 20 40 30 50 1.2 1.6 2.0 2.4 2.8 3.2 20.0 forward current (ma) forward current vs. luminous intensity relative luminous intensity 10.0 0 10.0 20.0 40.0 30.0 50.0 30.0 0.0 temperature( f c) 0 204060 100 80 forward current if(ma) 10 20 40 30 50 forward current vs. ambient temperature radiation diagram 0.7 0.8 0.9 1.0 0.1 0.5 0.3 0.2 0.4 0.6 90 60 80 70 50 10 0 20 40 30
MT6203-HRG-A 3.0mm round bi- polar lamp (3leads) ver.: 01 date: 2007/11/06 page: 5 /5 precautions: take note of the following in use of led 1. temperature in use since the light generated inside the led needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. consequently, the heat resistant ability of the resin used for led is usually low; therefore, please be careful on the following during use. avoid applying external force, stress, and excessi ve vibration to the resins and terminals at high temperature. the glass transition temperature of epoxy resin used for the led is approximately 120-130
. at a temperature exceeding this limit, the co efficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. if external force or stress is applied at that time, it may cause a wire rupture. 2. soldering please be careful on the following at soldering. after soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temp erature), (1) soldering measurements: distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) solder dip: preheat: 90
max. (backside of pcb), within 60 seconds solder bath: 260 ? 5
(solder temperature), within 5 seconds (3) soldering iron : 350
max. (temperature of solderin g iron tip), within 3 seconds 3. insertion pitch of the led leads and pitch of mounting holes need to be same 4. others since the heat resistant ability of the led re sin is low, smd components are used on the same pcb, please mount the led after adhesive baking process for smd components. in case adhesive baking is done after led lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the led and follow the conditions below. baking temperature: 120
max. baking time: within 60 seconds if soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the led to normal temperature.

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